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Future Trends of Flexible Circuit Boards
Rigid-Flex PCB Stack-up for Impedance Controlled Designs
Control Impedance Between Rigid PCB and Flex PCB
Flex PCB Reliability and Bendability
Normal Flex PCB Specifications
Flex PCB Polyimide Coverlay and Solder Mask
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About RA Copper and ED Copper
Introduction of Flexible PCB
5 Tips For Designing Flexible PCB
Advantages of FPC (Flexible PCB)
Evolution of the Flex Printed Circuit Board
Benefits of Using Flex Circuit Boards
Why Rigid-Flex PCBs are Economical?
Flexible PCB vs Rigid PCB
Development of Flexible printed circuit board (FPC) market
Traditional Manufacture Engineering of FPC Substrate
Development Trend of FPC Board
Flex PCB and the Manufacturing
About Flex PCB design
About Flex PCB and Assembly
How to Ensure Flex PCB Design Success
How to Select the Appropriate FPC Materials?
The Differences In Rigid PCB, Flex PCB and Rigid-Flex PCB
Flex-Rigid PCB Design Guidelines
Beneficials for Polyimide Flex PCB Boards
About Stiffener on Flex PCB FPC circuit Boards
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PCB Surface Finish Comparison
Copper Thickness for FPC Boards
Interconnect Solutions for Flexible Printed Circuits and Etched Foil Heaters
Advantages and Disadvantages of Rigid-Flex PCB
About FPC Plating Process
About EMI shield design for Flex Printed Circuit Board
PCB Assembly Blog
About PCB Assembly
QFP and BGA and the Development Trend in PCB assembly
Why some components need be baked before reflow soldering
About Flex PCB Assembly
Manual Soldering in SMT Assembly Manufacturing Process
BGA Components and BGA Assembly
Quick Understanding for PCB Assembly Process
About SMT Assembly (Surface Mount Technology)
About THT Assembly (Through-Hole Technology)
About Reflow Soldering
About_Wave_Soldering
PCB Assembly Inspections and Tests
Panel Requirements for PCB Assembly
About SMT (Surface Mount Technology)

Introduction:

 

The development of flexible and rigid-flex PCB has been following the trend of being more layers, thinner and higher density. This trend will lead to the development of corresponding materials, processing, equipment, and motivate new technologies.

 

Development Trend of New Materials and New Technologies:

 

The innovation of flexible printed circuit board has a high dependence on the development of new materials. The innovation of insulating substrates, adhesives, foils, cladding layers, reinforcing substrates and other materials used in flexible PCBs can make the boards develop towards higher performance. Because of the high matching requirement of various materials for the fabrication of flexible printed circuit boards, the diversified material system will provide manufacturers with a variety of choices and combinations. The properties of these materials are mainly reflected in thermal expansion coefficient, water absorption, bending degree and bending life and so on.

 

The development of new materials and new technologies in the PCB industry always promotes each other. Flexible PCB is more prominent because of its high performance requirements. For example, micro-hole processing technology is one of the core technologies of PCB innovation. In recent years, its development speed is much faster than etching, plating, interconnection and other technologies. In the micro-hole machining process of flexible PCB, the mechanical strength and deformation coefficient of different materials of each layer are usually taken into account to predict the deformation effect caused by the hole making, and finally the precise micro-hole machining is realized.

 

Development Trend of Rigid-Flex PCB:

 

Rigid PCB combines the advantages of flexible PCB and rigid PCB and is widely used in electronic products. The development of flexible PCB technology mentioned above is also suitable for the development of rigid PCB technology, and because the performance difference of materials involved in rigid PCB is relatively larger, most of these technical challenges are the choice of material combination in the final analysis. For example, in the process of multiple lamination, the difference in thermal expansion coefficient of each layer material in all directions should be considered, and the denaturation compensation should be carried out in combination with the use of reinforcing and reinforcing plates to achieve high-precision alignment lamination.

 

At the same time, the structure design of rigid-flex PCB has also been a hot spot in this field. Generally speaking, there are many possible design schemes for rigid-flex PCB with the same function. In the actual design, the reliability of the product, the occupied space, the weight, the difficulty of assembly and other aspects should be considered comprehensively. Combined with the manufacturer's production capacity and material factors, the design optimization should be carried out to select the scheme with the lowest cost. 

 

Conclusion:

 

The changing trend of flexible PCB towards multi-layer ultra-thin and high-density is bound to drive the corresponding development of upstream materials, processes and equipment, and stimulate the emergence of new technologies.

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