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FPCway is also a professional PCB Assembly manufacturer for SMD Assembly and THT assembly in Shenzhen China. Own 8 professional SMT lines (JUKI, GKG, YAMAHA, KIC, etc.) and 2 professional THT/DIP lines, we could provide our customers the best service and best quality, all PCB assembly boards will pass strict visual inspection, AOI and X-Ray test (if have BGA) before shipping to customers.
Through-hole technology (tht), also spelled "thru-hole", refers to the mounting scheme used for electronic components that involves the use of leads on the components that are inserted into holes drilled in printed circuit boards (PCB) and soldered to pads on the opposite side either by manual assembly (hand placement) or by the use of automated insertion mount machines.
Although the advantages of SMD manufacturing are considerable, it is not possible to do without THT (through-hole technology) assembly when manufacturing electronics. Straight components with a high mechanical load, such as connectors, switches or power semiconductors, are still assembled on a PCB using through-hole technology. These components rarely exist as SMD versions.
Our state-of-the-art electronics manufacturing use the advantages of SMD and THT assembly to ensure optimal production of your printed circuit board. Automated soldering processes allow us to solder wired components in a reflow oven (through-hole reflow or THR). This way, we shorten the usual THT assembly process and save on costs by eliminating manual or wave soldering, for example.
WE ALSO USE THE FOLLOWING SOLDERING METHODS IN THT MANUFACTURING:
While through-hole mounting provides strong mechanical bonds when compared to SMT techniques, the additional drilling required makes the boards more expensive to produce. They also limit the available routing area for signal traces on layers immediately below the top layer on multilayer boards since the holes must pass through all layers to the opposite side. To that end, through-hole mounting techniques are now usually reserved for bulkier or heavier components such as electrolytic capacitors or semiconductors in larger packages such as the TO-220 that require the additional mounting strength, or for components such as plug connectors or electromechanical relays that require great strength in support. Design engineers often prefer the larger through-hole rather than surface mount parts when prototyping, because they can be easily used with breadboard sockets. However, high-speed or high-frequency designs may require SMT technology to minimize stray inductance and capacitance in wire leads, which would impair circuit function. Ultra-compact designs may also dictate SMT construction, even in the prototype phase of design.
